Role of different factors affecting interdiffusion in Cu(Ga) and Cu(Si) solid solutions

Sangeeta Santra, Hongqun Dong, Tomi Laurila, Aloke Paul

Research output: Contribution to journal › Article › Scientific › peer-review

11 Citations (Scopus)

Original language	English
Pages (from-to)	1-19
Journal	PROCEEDINGS OF THE ROYAL SOCIETY A: MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES
Volume	470
Issue number	2161
DOIs	https://doi.org/10.1098/rspa.2013.0464
Publication status	Published - 2014
MoE publication type	A1 Journal article-refereed

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title = "Role of different factors affecting interdiffusion in Cu(Ga) and Cu(Si) solid solutions",

author = "Sangeeta Santra and Hongqun Dong and Tomi Laurila and Aloke Paul",

year = "2014",

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T1 - Role of different factors affecting interdiffusion in Cu(Ga) and Cu(Si) solid solutions

AU - Santra, Sangeeta

AU - Dong, Hongqun

AU - Laurila, Tomi

AU - Paul, Aloke

PY - 2014

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JO - PROCEEDINGS OF THE ROYAL SOCIETY A: MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES

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