Reliability Performance of Au-Sn and Cu-Sn Wafer Level SLID Bonds for MEMS

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review


Research units


Original languageEnglish
Title of host publication5th Electronics System-Integration Technology Conference (ESTC), Helsinki, Finland, 16 18, 2014
Publication statusPublished - 2014
MoE publication typeA4 Article in a conference publication

ID: 614143