Reliability of wafer-level SLID bonds for MEMS encapsulation

Hongbo Xu, Mikael Broas, Hongqun Dong, Vesa Vuorinen, Tommi Suni, Sami Vähänen, Philippe Monnoyer, Mervi Paulasto-Kröckel

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

3 Citations (Scopus)
Original languageEnglish
Title of host publicationEurope Microelectronics Packaging Conference (EMPC2013)
Place of PublicationGrenoble, France
Publication statusPublished - 2013
MoE publication typeA4 Article in a conference publication

Cite this