Reliability of wafer-level SLID bonds for MEMS encapsulation

Hongbo Xu; Mikael Broas; Hongqun Dong; Vesa Vuorinen; Tommi Suni; Sami Vähänen; Philippe Monnoyer; Mervi Paulasto-Kröckel

Reliability of wafer-level SLID bonds for MEMS encapsulation

Hongbo Xu, Mikael Broas, Hongqun Dong, Vesa Vuorinen, Tommi Suni, Sami Vähänen, Philippe Monnoyer, Mervi Paulasto-Kröckel

Electronics Integration and Reliability

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

3 Citations (Scopus)

Original language	English
Title of host publication	Europe Microelectronics Packaging Conference (EMPC2013)
Place of Publication	Grenoble, France
Publication status	Published - 2013
MoE publication type	A4 Conference publication

Cite this

@inproceedings{2795cfb3101d420b84dc3ce64999698d,

title = "Reliability of wafer-level SLID bonds for MEMS encapsulation",

author = "Hongbo Xu and Mikael Broas and Hongqun Dong and Vesa Vuorinen and Tommi Suni and Sami V{\"a}h{\"a}nen and Philippe Monnoyer and Mervi Paulasto-Kr{\"o}ckel",

year = "2013",

language = "English",

booktitle = "Europe Microelectronics Packaging Conference (EMPC2013)",

}

TY - GEN

T1 - Reliability of wafer-level SLID bonds for MEMS encapsulation

AU - Xu, Hongbo

AU - Broas, Mikael

AU - Dong, Hongqun

AU - Vuorinen, Vesa

AU - Suni, Tommi

AU - Vähänen, Sami

AU - Monnoyer, Philippe

AU - Paulasto-Kröckel, Mervi

PY - 2013

Y1 - 2013

M3 - Conference article in proceedings

BT - Europe Microelectronics Packaging Conference (EMPC2013)

CY - Grenoble, France

ER -