Reliability of Wafer-Level Chip Scale Packages under Mechanical Shock Loading

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Original language	English
Title of host publication	the 56th Electronic Component and Technology Conference (ECTC), San Diego CA, USA, May 30 to June 2 2006
Publication status	Published - 2006
MoE publication type	A4 Conference publication

Keywords

@inproceedings{a2ce21a4f6b2444facf4b8c884bc3d62,

title = "Reliability of Wafer-Level Chip Scale Packages under Mechanical Shock Loading",

keywords = "reliability, reliability, reliability",

author = "T.T. Mattila and P. Marjam{\"a}ki and J.K. Kivilahti",

year = "2006",

language = "English",

booktitle = "the 56th Electronic Component and Technology Conference (ECTC), San Diego CA, USA, May 30 to June 2 2006",

}

TY - GEN

T1 - Reliability of Wafer-Level Chip Scale Packages under Mechanical Shock Loading

AU - Mattila, T.T.

AU - Marjamäki, P.

AU - Kivilahti, J.K.

PY - 2006

Y1 - 2006

KW - reliability

M3 - Conference article in proceedings

BT - the 56th Electronic Component and Technology Conference (ECTC), San Diego CA, USA, May 30 to June 2 2006

ER -