Reliability of Wafer-Level Chip Scale Packages under Mechanical Shock Loading

T.T. Mattila, P. Marjamäki, J.K. Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publicationthe 56th Electronic Component and Technology Conference (ECTC), San Diego CA, USA, May 30 to June 2 2006
    Publication statusPublished - 2006
    MoE publication typeA4 Article in a conference publication

    Keywords

    • reliability

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