Reliability of tantalum based diffusion barriers between Cu and Si

T. Laurila*, K. Zeng, A. Seppälä, J. Molarius, I. Suni, J. K. Kivilahti

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    2 Citations (Scopus)

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    Chemical Compounds

    Engineering & Materials Science