Reliability of SnAgCu Interconnections with Minor Additions of Ni or Bi under Mechanical Schock Loading at Elevated Temperatures

Toni Mattila, Essi Kaloinen, A. Syed, Jorma Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publicationThe 57th Electronic Component and Technology Conference, Reno, NV, USA, 29 May - 1 June
    Publication statusPublished - 2007
    MoE publication typeA4 Article in a conference publication

    Cite this