Reliability of SnAgCu interconnections with minor additions of Ni or Bi under mechanical shock loading at elevated temperatures

Toni Tuomas Mattila, Essi Kaloinen, Ahmer Syed, Jorma Kalevi Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publication57th Electronic Component and Technology Conference, Reno, NV, May 29- June 1, 2007
    Publication statusPublished - 2007
    MoE publication typeA4 Article in a conference publication

    Publication series

    ISSN (Print)0569-5503

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