Reliability of SnAgCu interconnections with minor additions of Ni or Bi under mechanical shock loading at elevated temperatures

Toni Tuomas Mattila, Essi Kaloinen, Ahmer Syed, Jorma Kalevi Kivilahti

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

Original language	English
Title of host publication	57th Electronic Component and Technology Conference, Reno, NV, May 29- June 1, 2007
Pages	381-390
Publication status	Published - 2007
MoE publication type	A4 Article in a conference publication

Name
ISSN (Print)	0569-5503

Access to Document

@inproceedings{23ea37123cdd475c91ad30cbee370645,

title = "Reliability of SnAgCu interconnections with minor additions of Ni or Bi under mechanical shock loading at elevated temperatures",

author = "Mattila, {Toni Tuomas} and Essi Kaloinen and Ahmer Syed and Kivilahti, {Jorma Kalevi}",

year = "2007",

language = "English",

isbn = "1-4244-0985-3",

pages = "381--390",

booktitle = "57th Electronic Component and Technology Conference, Reno, NV, May 29- June 1, 2007",

}

57th Electronic Component and Technology Conference, Reno, NV, May 29- June 1, 2007. 2007. p. 381-390.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Reliability of SnAgCu interconnections with minor additions of Ni or Bi under mechanical shock loading at elevated temperatures

AU - Mattila, Toni Tuomas

AU - Kaloinen, Essi

AU - Syed, Ahmer

AU - Kivilahti, Jorma Kalevi

PY - 2007

Y1 - 2007

UR - http://ieeexplore.ieee.org

M3 - Conference contribution

SN - 1-4244-0985-3

SP - 381

EP - 390

BT - 57th Electronic Component and Technology Conference, Reno, NV, May 29- June 1, 2007

ER -