Reliability of Microjoints in Electronics Assemblies

J. Kivilahti

Reliability of Microjoints in Electronics Assemblies

J. Kivilahti

Department of Built Environment

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Original language	English
Title of host publication	The Proc. of the International Nokia Interconnection and Packaging Colloqium, Nokia research Centre Helsinki, 28.3.1996
Pages	28
Publication status	Published - 1996
MoE publication type	A4 Conference publication

Keywords

electronics assemblies
microjoints
reliability

Cite this

@inproceedings{7409f6018ecf4b91bfa2907b698ba283,

title = "Reliability of Microjoints in Electronics Assemblies",

keywords = "electronics assemblies, microjoints, reliability, electronics assemblies, microjoints, reliability, electronics assemblies, microjoints, reliability",

author = "J. Kivilahti",

year = "1996",

language = "English",

pages = "28",

booktitle = "The Proc. of the International Nokia Interconnection and Packaging Colloqium, Nokia research Centre Helsinki, 28.3.1996",

}

TY - GEN

T1 - Reliability of Microjoints in Electronics Assemblies

AU - Kivilahti, J.

PY - 1996

Y1 - 1996

KW - electronics assemblies

KW - microjoints

KW - reliability

KW - electronics assemblies

KW - microjoints

KW - reliability

KW - electronics assemblies

KW - microjoints

KW - reliability

M3 - Conference article in proceedings

SP - 28

BT - The Proc. of the International Nokia Interconnection and Packaging Colloqium, Nokia research Centre Helsinki, 28.3.1996

ER -