Reliability of Lead-free CSP Interconnections Under Thermal Cycling and Mechanical Shock Loading Conditions

T. Mattila, P. Marjamäki, Jorma K. Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publicationThe 2006 IEEE/EIA CPMT Electronic Component and Technology Conference (ECTC'06)
    Publication statusPublished - 2006
    MoE publication typeA4 Article in a conference publication

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