Reliability of Electronic Assemblies Under Mechanical Shock Loading

Toni Tuomas Mattila, Tomi Taneli Laurila, Vesa Vuorinen, Jorma Kalevi Kivilahti

Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

Original languageEnglish
Title of host publicationThe ELFNET Book on Failure Mechanisms, Testing Methods and Quality Issues of Lead-Free Solder Interconnects
EditorsGünter Grossmann, Christian Zanardi
Place of PublicationLondon, UK
Pages197-225
DOIs
Publication statusPublished - 2011
MoE publication typeA3 Part of a book or another research book

Keywords

  • drop reliability
  • intermetallic layers
  • solder interconnection

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