Reliability of Electronic Assemblies Under Mechanical Shock Loading

Toni Tuomas Mattila; Tomi Taneli Laurila; Vesa Vuorinen; Jorma Kalevi Kivilahti

doi:/10.1007/978-0-85729-236-0_9

Reliability of Electronic Assemblies Under Mechanical Shock Loading

Toni Tuomas Mattila, Tomi Taneli Laurila, Vesa Vuorinen, Jorma Kalevi Kivilahti

Microsystems Technology

Research output: Chapter in Book/Report/Conference proceeding › Chapter › Scientific › peer-review

Original language	English
Title of host publication	The ELFNET Book on Failure Mechanisms, Testing Methods and Quality Issues of Lead-Free Solder Interconnects
Editors	Günter Grossmann, Christian Zanardi
Place of Publication	London, UK
Publisher	Springer
Pages	197-225
DOIs	https://doi.org//10.1007/978-0-85729-236-0_9
Publication status	Published - 2011
MoE publication type	A3 Book section, Chapters in research books

Keywords

drop reliability
intermetallic layers
solder interconnection

Access to Document

/10.1007/978-0-85729-236-0_9

Cite this

@inbook{12ddf00109c044199cbfa690224ac57a,

title = "Reliability of Electronic Assemblies Under Mechanical Shock Loading",

keywords = "drop reliability, intermetallic layers, solder interconnection, drop reliability, intermetallic layers, solder interconnection, drop reliability, intermetallic layers, solder interconnection",

author = "Mattila, {Toni Tuomas} and Laurila, {Tomi Taneli} and Vesa Vuorinen and Kivilahti, {Jorma Kalevi}",

year = "2011",

doi = "/10.1007/978-0-85729-236-0_9",

language = "English",

pages = "197--225",

editor = "G{\"u}nter Grossmann and Christian Zanardi",

booktitle = "The ELFNET Book on Failure Mechanisms, Testing Methods and Quality Issues of Lead-Free Solder Interconnects",

publisher = "Springer",

address = "Germany",

}

Reliability of Electronic Assemblies Under Mechanical Shock Loading. / Mattila, Toni Tuomas; Laurila, Tomi Taneli ; Vuorinen, Vesa et al.
The ELFNET Book on Failure Mechanisms, Testing Methods and Quality Issues of Lead-Free Solder Interconnects. ed. / Günter Grossmann; Christian Zanardi. London, UK: Springer, 2011. p. 197-225.

Research output: Chapter in Book/Report/Conference proceeding › Chapter › Scientific › peer-review

TY - CHAP

T1 - Reliability of Electronic Assemblies Under Mechanical Shock Loading

AU - Mattila, Toni Tuomas

AU - Laurila, Tomi Taneli

AU - Vuorinen, Vesa

AU - Kivilahti, Jorma Kalevi

PY - 2011

Y1 - 2011

KW - drop reliability

KW - intermetallic layers

KW - solder interconnection

KW - drop reliability

KW - intermetallic layers

KW - solder interconnection

KW - drop reliability

KW - intermetallic layers

KW - solder interconnection

U2 - /10.1007/978-0-85729-236-0_9

DO - /10.1007/978-0-85729-236-0_9

M3 - Chapter

SP - 197

EP - 225

BT - The ELFNET Book on Failure Mechanisms, Testing Methods and Quality Issues of Lead-Free Solder Interconnects

A2 - Grossmann, Günter

A2 - Zanardi, Christian

PB - Springer

CY - London, UK

ER -