Reliability of CSP Interconnections under Shock Loading Conditions

T.T. Mattila, P. Marjamäki, Jorma K. Kivilahti

Research output: Contribution to journal › Article › Scientific › peer-review

Original language	English
Pages (from-to)	787-795
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	29
Issue number	4
Publication status	Published - 2006
MoE publication type	A1 Journal article-refereed

Cite this

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title = "Reliability of CSP Interconnections under Shock Loading Conditions",

author = "T.T. Mattila and P. Marjam{\"a}ki and Kivilahti, {Jorma K.}",

year = "2006",

language = "English",

volume = "29",

pages = "787--795",

journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",

issn = "2156-3950",

publisher = "IEEE",

number = "4",

}

TY - JOUR

T1 - Reliability of CSP Interconnections under Shock Loading Conditions

AU - Mattila, T.T.

AU - Marjamäki, P.

AU - Kivilahti, Jorma K.

PY - 2006

Y1 - 2006

M3 - Article

SN - 2156-3950

VL - 29

SP - 787

EP - 795

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

IS - 4

ER -