Original language | English |
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Title of host publication | The 2006 IEEE/EIA CPMT Electronic Component and Technology Conference (ECTC'06) |
Pages | pp. |
Publication status | Published - 2006 |
MoE publication type | A4 Conference publication |
Reliability of Chip Scale Packages Under Mechanical Shock Loading
T.T. Mattila, P. Marjamäki, L. Nguyen, Jorma K. Kivilahti
Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
6
Citations
(Scopus)