Reliability lead-free interconnections under consecutive thermal and mechanical loadings

Research output: Contribution to journalArticleScientificpeer-review

Researchers

  • T.T. Mattila
  • J.K. Kivilahti

Research units

Details

Original languageEnglish
Pages (from-to)250-255
JournalJournal of Electronic Materials
Volume35
Issue number2
Publication statusPublished - 2006
MoE publication typeA1 Journal article-refereed

    Research areas

  • reliability

ID: 3448840