Reliability lead-free interconnections under consecutive thermal and mechanical loadings

T.T. Mattila, J.K. Kivilahti

Research output: Contribution to journal › Article › Scientific › peer-review

92 Citations (Scopus)

Original language	English
Pages (from-to)	250-255
Journal	Journal of Electronic Materials
Volume	35
Issue number	2
Publication status	Published - 2006
MoE publication type	A1 Journal article-refereed

Keywords

@article{e13704256a5844bd9defb2769eb4e69e,

title = "Reliability lead-free interconnections under consecutive thermal and mechanical loadings",

keywords = "reliability, reliability, reliability",

author = "T.T. Mattila and J.K. Kivilahti",

year = "2006",

language = "English",

volume = "35",

pages = "250--255",

journal = "Journal of Electronic Materials",

issn = "1543-186X",

publisher = "Springer",

number = "2",

}

TY - JOUR

T1 - Reliability lead-free interconnections under consecutive thermal and mechanical loadings

AU - Mattila, T.T.

AU - Kivilahti, J.K.

PY - 2006

Y1 - 2006

KW - reliability

UR - https://www.scopus.com/pages/publications/33644921774

M3 - Article

SN - 1543-186X

VL - 35

SP - 250

EP - 255

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 2

ER -