Reliability lead-free interconnections under consecutive thermal and mechanical loadings

T.T. Mattila, J.K. Kivilahti

Research output: Contribution to journal › Article › Scientific › peer-review

89 Citations (Scopus)

Original language	English
Pages (from-to)	250-255
Journal	Journal of Electronic Materials
Volume	35
Issue number	2
Publication status	Published - 2006
MoE publication type	A1 Journal article-refereed

Keywords

@article{e13704256a5844bd9defb2769eb4e69e,

title = "Reliability lead-free interconnections under consecutive thermal and mechanical loadings",

keywords = "reliability, reliability, reliability",

author = "T.T. Mattila and J.K. Kivilahti",

year = "2006",

language = "English",

volume = "35",

pages = "250--255",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

number = "2",

}