Reliability lead-free interconnections under consecutive thermal and mechanical loadings

T.T. Mattila, J.K. Kivilahti

    Research output: Contribution to journalArticleScientificpeer-review

    89 Citations (Scopus)
    Original languageEnglish
    Pages (from-to)250-255
    JournalJournal of Electronic Materials
    Volume35
    Issue number2
    Publication statusPublished - 2006
    MoE publication typeA1 Journal article-refereed

    Keywords

    • reliability

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