Reliability assessment of electronic assemblies under multiple interacting loading conditions

Juha Karppinen

    Research output: ThesisDoctoral ThesisCollection of Articles

    Abstract

    This dissertation presents the results of multiple experimental and computational reliability assessment methods employed on electronic assemblies. It is demonstrated that the typical standardized test procedures often fail to capture the complex loading conditions of service environment and can lead to artificial results due to excessive damage acceleration. An alternative reliability assessment approach based on the use of combined loading tests derived from product service loading characterization is proposed as a solution to the problem. In this proposed approach special attention is paid to establishing a stronger correlation between the material-scientific reliability analyses and lifetime prediction methods. Several methods on how to predict and characterize the reliability of component assemblies under different use cases and field environments are presented. Particular emphasis is placed on the reliability of board-level solder interconnections due to their complex and often unsatisfactory reliability behavior. It is shown that multiple microstructural mechanisms, such as dispersion strengthening, grain growth, strain rate hardening, fatigue and recrystallization, contribute together to the reliability performance of interconnections. The presented relationships between these mechanisms and the affecting loading conditions enable more accurate and comprehensive assessment of electronic product reliability.
    Translated title of the contributionElektronisten kokoonpanojen luotettavuuden arviointi useiden vuorovaikuttavienrasitustilojen alaisuudessa
    Original languageEnglish
    QualificationDoctor's degree
    Awarding Institution
    • Aalto University
    Supervisors/Advisors
    • Paulasto-Kröckel, Mervi, Supervising Professor
    • Laurila, Tomi, Thesis Advisor
    • Mattila, Toni, Thesis Advisor
    Publisher
    Print ISBNs978-952-60-4995-3
    Electronic ISBNs978-952-60-4996-0
    Publication statusPublished - 2013
    MoE publication typeG5 Doctoral dissertation (article)

    Keywords

    • combined load testing
    • electronic assembly
    • solder interconnection
    • mechanical load
    • electrical load
    • thermal load
    • thermal cycling

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