Reliability Aspects of Lead-Free Solders in Electronic Assemblies

V. Pulicandla; S Dunford; Jorma Kivilahti

Reliability Aspects of Lead-Free Solders in Electronic Assemblies

V. Pulicandla, S Dunford, Jorma Kivilahti

Research output: Chapter in Book/Report/Conference proceeding › Chapter › Scientific › peer-review

Original language	English
Title of host publication	The Handbook of Lead(Pb)-Free Technology for Microelectronics Assemblies
Editors	Karl Puttliz, Kathleen Stalter, Marcel Dekker
Place of Publication	New York, USA
Publisher	Marcel Dekker
Pages	769-850
Publication status	Published - 2004
MoE publication type	A3 Book section, Chapters in research books

Cite this

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title = "Reliability Aspects of Lead-Free Solders in Electronic Assemblies",

author = "V. Pulicandla and S Dunford and Jorma Kivilahti",

year = "2004",

language = "English",

pages = "769--850",

editor = "Karl Puttliz and Kathleen Stalter and Marcel Dekker",

booktitle = "The Handbook of Lead(Pb)-Free Technology for Microelectronics Assemblies",

publisher = "Marcel Dekker",

address = "United States",

}

Reliability Aspects of Lead-Free Solders in Electronic Assemblies. / Pulicandla, V.; Dunford, S; Kivilahti, Jorma.
The Handbook of Lead(Pb)-Free Technology for Microelectronics Assemblies. ed. / Karl Puttliz; Kathleen Stalter; Marcel Dekker. New York, USA: Marcel Dekker, 2004. p. 769-850.

Research output: Chapter in Book/Report/Conference proceeding › Chapter › Scientific › peer-review

TY - CHAP

T1 - Reliability Aspects of Lead-Free Solders in Electronic Assemblies

AU - Pulicandla, V.

AU - Dunford, S

AU - Kivilahti, Jorma

PY - 2004

Y1 - 2004

M3 - Chapter

SP - 769

EP - 850

BT - The Handbook of Lead(Pb)-Free Technology for Microelectronics Assemblies

A2 - Puttliz, Karl

A2 - Stalter, Kathleen

A2 - Dekker, Marcel

PB - Marcel Dekker

CY - New York, USA

ER -