Rapid thermal annealing of Cu/WNx/Si structures

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Original languageEnglish
Pages (from-to)315-318
JournalJournal of Materials Science: Materials in Electronics
Volume14
Publication statusPublished - 2003
MoE publication typeA1 Journal article-refereed

    Research areas

  • copper metallization, rapid thermal annealing, semiconductor devices

ID: 4152401