Rapid thermal annealing of Cu/WNx/Si structures

Antti Lipsanen, Pekka Kuivalainen, Eero Rauhala, Sami Franssila, Anu Seppälä

Research output: Contribution to journalArticleScientificpeer-review

1 Citation (Scopus)
Original languageEnglish
Pages (from-to)315-318
JournalJournal of Materials Science: Materials in Electronics
Volume14
Publication statusPublished - 2003
MoE publication typeA1 Journal article-refereed

Keywords

  • copper metallization
  • rapid thermal annealing
  • semiconductor devices

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