@article{3fc897db4cbe47588006746aceb4b522,
title = "Rapid thermal annealing of Cu/WNx/Si structures",
keywords = "copper metallization, rapid thermal annealing, semiconductor devices, copper metallization, rapid thermal annealing, semiconductor devices, copper metallization, rapid thermal annealing, semiconductor devices",
author = "Antti Lipsanen and Pekka Kuivalainen and Eero Rauhala and Sami Franssila and Anu Sepp{\"a}l{\"a}",
year = "2003",
language = "English",
volume = "14",
pages = "315--318",
journal = "Journal of Materials Science: Materials in Electronics",
issn = "0957-4522",
publisher = "Springer New York",
}