Pull-off test in the assessement of adhesion at printed wiring board metallisation/epoxy interface

Markus P.K Turunen, Pekka Marjamäki, Matti Paajanen, Jouko Lahtinen, Jorma K. Kivilahti

Research output: Contribution to journal › Article › Scientific › peer-review

68 Citations (Scopus)

Original language	English
Pages (from-to)	993-1007
Journal	Microelectronics Reliability
Issue number	44
Publication status	Published - 2004
MoE publication type	A1 Journal article-refereed

Keywords

@article{40eb695215ee406fa2210c4e927ef325,

title = "Pull-off test in the assessement of adhesion at printed wiring board metallisation/epoxy interface",

keywords = "adhesion, printed circuit board, XPS, adhesion, printed circuit board, XPS, adhesion, printed circuit board, XPS",

author = "Turunen, {Markus P.K} and Pekka Marjam{\"a}ki and Matti Paajanen and Jouko Lahtinen and Kivilahti, {Jorma K.}",

year = "2004",

language = "English",

pages = "993--1007",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier",

number = "44",

}

TY - JOUR

T1 - Pull-off test in the assessement of adhesion at printed wiring board metallisation/epoxy interface

AU - Turunen, Markus P.K

AU - Marjamäki, Pekka

AU - Paajanen, Matti

AU - Lahtinen, Jouko

AU - Kivilahti, Jorma K.

PY - 2004

Y1 - 2004

KW - adhesion

KW - printed circuit board

KW - XPS

KW - adhesion

KW - printed circuit board

KW - XPS

KW - adhesion

KW - printed circuit board

KW - XPS

M3 - Article

SN - 0026-2714

SP - 993

EP - 1007

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 44

ER -