Pull-off test in the assessement of adhesion at printed wiring board metallisation/epoxy interface

Markus P.K Turunen, Pekka Marjamäki, Matti Paajanen, Jouko Lahtinen, Jorma K. Kivilahti

Research output: Contribution to journalArticleScientificpeer-review

59 Citations (Scopus)
Original languageEnglish
Pages (from-to)993-1007
JournalMicroelectronics Reliability
Issue number44
Publication statusPublished - 2004
MoE publication typeA1 Journal article-refereed

Keywords

  • adhesion
  • printed circuit board
  • XPS

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