Process Integration and Reliability of Wafer Level SLID Bonding for Poly-Si TSV capped MEMS

Vesa Vuorinen, Glenn Ross, Heikki Viljanen, James Decker, Mervi Paulasto-Krockel

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

3 Citations (Scopus)
405 Downloads (Pure)

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