Process Integration and Reliability of Wafer Level SLID Bonding for Poly-Si TSV capped MEMS

Vesa Vuorinen, Glenn Ross, Heikki Viljanen, James Decker, Mervi Paulasto-Krockel

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

1 Citation (Scopus)
251 Downloads (Pure)

Abstract

The objective of this study was to develop a fully integrated process for wafer level MEMS packaging utilizing PolySi through silicon via (TSV) capped MEMS devices. First, interconnection metallurgy and Solid Liquid Interdiffusion (SLID) bonding process was optimized. Then sc.'vias before bonding' capping process and contact metallizations for Poly-Si TSVs were developed. Finally, the process integration was demonstrated by using piezoelectrically driven MEMSactuators. However, several design and manufacturing related challenges were observed and detailed failure analysis were carried out to resolve these problems.

Original languageEnglish
Title of host publicationProceedings of the 2018 7th Electronic System-Integration Technology Conference, ESTC 2018
PublisherIEEE
Number of pages6
ISBN (Electronic)9781538668139
DOIs
Publication statusPublished - 26 Nov 2018
MoE publication typeA4 Article in a conference publication
EventElectronic System Integration Technology Conference - Dresden, Germany
Duration: 18 Sep 201821 Sep 2018
Conference number: 7

Conference

ConferenceElectronic System Integration Technology Conference
Abbreviated titleESTC
CountryGermany
CityDresden
Period18/09/201821/09/2018

Keywords

  • MEMS
  • Process integration
  • Reliability
  • Wafer level SLID bonding

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