Abstract
A procedure and an apparatus for improving a plating apparatus used for diamond plating, in which plating process a first arc is started between a first electrode (1') and a firing element (5') placed in connection with it, another arc is started by means of the first one between the first electrode (1') and a second electrode (3) and a plasma spray formed from material released from the first electrode (1') is directed towards the material to be plated. That surface (10') of the first electrode from which material is released is abraded continuously during the plating process by an arrangement whereby the emitting surface and at least one grinding element (11', 5') placed in contact with it are brought into motion relative to each other.
| Original language | English |
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| Patent number | WO9314239 |
| IPC | H05H 1/ 50 A I |
| Priority date | 10/01/1992 |
| Publication status | Accepted/In press - 22 Jul 1993 |
| MoE publication type | H1 Granted patent |