Printed Circuit-Based Thermoelectric Sensor Film for Temperature Distribution Measurements

Antti Immonen; Priyanka Goel; Tomi Koskinen; Matias Pekkanen; Ilkka Tittonen; Tommi Kärkkäinen; Pertti Silventoinen; Mikko Kuisma

doi:10.1109/I2MTC60896.2024.10561216

Printed Circuit-Based Thermoelectric Sensor Film for Temperature Distribution Measurements

Antti Immonen, Priyanka Goel, Tomi Koskinen, Matias Pekkanen, Ilkka Tittonen, Tommi Kärkkäinen, Pertti Silventoinen, Mikko Kuisma

LUT University

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

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Abstract

Augmented measurements of temperature distributions and the movement of heat are possible with multichannel, bendable temperature sensor films. In this paper, a method for manufacturing a laterally configured thermoelectric thermal distribution sensor structure based on printed circuit technology is presented. The proposed device incorporates an array of inplane single-pair thermocouples into a flexible substrate. The design and prototype manufacturing process of the sensor are detailed. The results of preliminary characterization tests show that the developed sensor can be used to roughly map changes in in-plane thermal fields.

Original language	English
Title of host publication	I2MTC 2024 - Instrumentation and Measurement Technology Conference
Publisher	IEEE
Number of pages	6
ISBN (Electronic)	979-8-3503-8090-3
DOIs	https://doi.org/10.1109/I2MTC60896.2024.10561216
Publication status	Published - 2024
MoE publication type	A4 Conference publication
Event	IEEE International Instrumentation and Measurement Technology Conference - Glasgow, United Kingdom Duration: 20 May 2024 → 23 May 2024

Publication series

Name	IEEE International Instrumentation and Measurement Technology Conference
ISSN (Print)	2642-2069
ISSN (Electronic)	2642-2077

Conference

Conference	IEEE International Instrumentation and Measurement Technology Conference
Abbreviated title	I2MTC
Country/Territory	United Kingdom
City	Glasgow
Period	20/05/2024 → 23/05/2024

Keywords

Flexible Printed Circuit
Heat Flux
Sensor
Temperature distribution
Thermocouple
Thermoelectric

Access to Document

10.1109/I2MTC60896.2024.10561216

Printed_Circuit-Based_Thermoelectric_Sensor_Film_for_Temperature_Distribution_Measurements (002)Accepted author manuscript, 18.1 MB

Cite this

Immonen, A., Goel, P., Koskinen, T., Pekkanen, M., Tittonen, I., Kärkkäinen, T., Silventoinen, P., & Kuisma, M. (2024). Printed Circuit-Based Thermoelectric Sensor Film for Temperature Distribution Measurements. In I2MTC 2024 - Instrumentation and Measurement Technology Conference (IEEE International Instrumentation and Measurement Technology Conference). IEEE. https://doi.org/10.1109/I2MTC60896.2024.10561216

@inproceedings{f9aa0df6cdcc4343b2d163d95cc48315,

title = "Printed Circuit-Based Thermoelectric Sensor Film for Temperature Distribution Measurements",

abstract = "Augmented measurements of temperature distributions and the movement of heat are possible with multichannel, bendable temperature sensor films. In this paper, a method for manufacturing a laterally configured thermoelectric thermal distribution sensor structure based on printed circuit technology is presented. The proposed device incorporates an array of inplane single-pair thermocouples into a flexible substrate. The design and prototype manufacturing process of the sensor are detailed. The results of preliminary characterization tests show that the developed sensor can be used to roughly map changes in in-plane thermal fields.",

keywords = "Flexible Printed Circuit, Heat Flux, Sensor, Temperature distribution, Thermocouple, Thermoelectric",

author = "Antti Immonen and Priyanka Goel and Tomi Koskinen and Matias Pekkanen and Ilkka Tittonen and Tommi K{\"a}rkk{\"a}inen and Pertti Silventoinen and Mikko Kuisma",

note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; IEEE International Instrumentation and Measurement Technology Conference, I2MTC ; Conference date: 20-05-2024 Through 23-05-2024",

year = "2024",

doi = "10.1109/I2MTC60896.2024.10561216",

language = "English",

series = "IEEE International Instrumentation and Measurement Technology Conference",

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booktitle = "I2MTC 2024 - Instrumentation and Measurement Technology Conference",

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Immonen, A, Goel, P, Koskinen, T, Pekkanen, M, Tittonen, I, Kärkkäinen, T, Silventoinen, P & Kuisma, M 2024, Printed Circuit-Based Thermoelectric Sensor Film for Temperature Distribution Measurements. in I2MTC 2024 - Instrumentation and Measurement Technology Conference. IEEE International Instrumentation and Measurement Technology Conference, IEEE, IEEE International Instrumentation and Measurement Technology Conference, Glasgow, United Kingdom, 20/05/2024. https://doi.org/10.1109/I2MTC60896.2024.10561216

Printed Circuit-Based Thermoelectric Sensor Film for Temperature Distribution Measurements. / Immonen, Antti; Goel, Priyanka; Koskinen, Tomi et al.
I2MTC 2024 - Instrumentation and Measurement Technology Conference. IEEE, 2024. (IEEE International Instrumentation and Measurement Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Printed Circuit-Based Thermoelectric Sensor Film for Temperature Distribution Measurements

AU - Immonen, Antti

AU - Goel, Priyanka

AU - Koskinen, Tomi

AU - Pekkanen, Matias

AU - Tittonen, Ilkka

AU - Kärkkäinen, Tommi

AU - Silventoinen, Pertti

AU - Kuisma, Mikko

PY - 2024

Y1 - 2024

N2 - Augmented measurements of temperature distributions and the movement of heat are possible with multichannel, bendable temperature sensor films. In this paper, a method for manufacturing a laterally configured thermoelectric thermal distribution sensor structure based on printed circuit technology is presented. The proposed device incorporates an array of inplane single-pair thermocouples into a flexible substrate. The design and prototype manufacturing process of the sensor are detailed. The results of preliminary characterization tests show that the developed sensor can be used to roughly map changes in in-plane thermal fields.

AB - Augmented measurements of temperature distributions and the movement of heat are possible with multichannel, bendable temperature sensor films. In this paper, a method for manufacturing a laterally configured thermoelectric thermal distribution sensor structure based on printed circuit technology is presented. The proposed device incorporates an array of inplane single-pair thermocouples into a flexible substrate. The design and prototype manufacturing process of the sensor are detailed. The results of preliminary characterization tests show that the developed sensor can be used to roughly map changes in in-plane thermal fields.

KW - Flexible Printed Circuit

KW - Heat Flux

KW - Sensor

KW - Temperature distribution

KW - Thermocouple

KW - Thermoelectric

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U2 - 10.1109/I2MTC60896.2024.10561216

DO - 10.1109/I2MTC60896.2024.10561216

M3 - Conference article in proceedings

AN - SCOPUS:85197806131

T3 - IEEE International Instrumentation and Measurement Technology Conference

BT - I2MTC 2024 - Instrumentation and Measurement Technology Conference

PB - IEEE

T2 - IEEE International Instrumentation and Measurement Technology Conference

Y2 - 20 May 2024 through 23 May 2024

ER -

Printed Circuit-Based Thermoelectric Sensor Film for Temperature Distribution Measurements

Abstract

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Keywords

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Aalto Electronics-ICT

Cite this

Printed Circuit-Based Thermoelectric Sensor Film for Temperature Distribution Measurements

Abstract

Publication series

Conference

Keywords

Access to Document

Other files and links

Fingerprint

Equipment

Aalto Electronics-ICT

Cite this