Prediction of thermal sensation using low-cost infrared array sensors monitoring system

Yuxin Wu*, Hong Liu, Baizhan Li, Risto Kosonen

*Corresponding author for this work

Research output: Contribution to journalConference articleScientificpeer-review

13 Citations (Scopus)
101 Downloads (Pure)

Abstract

Using skin temperature to predict thermal comfort typically results in higher accuracy of thermal comfort prediction compared to other methods, however, such nonintrusive thermo-graphic cameras with high resolution/accuracy are more expensive compared to the thermistors with single point. Thus, a low-cost (and low resolution) thermal camera MLX90640 was studied in this study to predict individual thermal comfort, and compared with the prediction results from high accuracy thermocouple at single point of somewhere of localized body skin. Results show that the low-cost (low resolution) infrared camera (MLX90640) with accuracy of ± 2 °C and resolution of 32 × 24 pixels is able to be used to predict thermal sensation with a performance better than skin temperature measure system including thermocouples at different points of skin with an accuracy of ±0.15 °C. And the performance of infrared camera (MLX90640) is as good as the performance of environmental air temperature sensor with accuracy of ±0.10 °C. Thus, the usage of low-cost (and low resolution) thermal camera to predict individual thermal comfort worth to be further studied.

Original languageEnglish
Article number032002
Number of pages7
JournalIOP Conference Series: Materials Science and Engineering
Volume609
Issue number3
DOIs
Publication statusPublished - 23 Oct 2019
MoE publication typeA4 Conference publication
EventInternational Conference on Indoor Air Quality, Ventilation and Energy Conservation in Buildings - Bari, Italy
Duration: 5 Sept 20197 Sept 2019
Conference number: 10

Fingerprint

Dive into the research topics of 'Prediction of thermal sensation using low-cost infrared array sensors monitoring system'. Together they form a unique fingerprint.

Cite this