Phase evolution in the AuCu/Sn system by solid-state reactive diffusion

Sangeeta Santra, Sarfaraj Islam, Raju Ravi, Vesa Vuorinen, Tomi Laurila, Aloke Paul

Research output: Contribution to journalArticleScientificpeer-review

3 Citations (Scopus)

Abstract

The interfacial reactions between several Au(Cu) alloys and pure Sn were studied experimentally at 200°C. Amounts of Cu in the AuSn4 and AuSn2 phases were as low as 1 at.%. On the basis of these experimental results there is no continuous solid solution between (Au,Cu)Sn and (Cu,Au)6Sn5. The copper content of (Au,Cu)Sn was determined to be approximately 7-8 at.%. Substantial amounts of Au were present in the (Cu,Au)6Sn5 and (Cu,Au)3Sn phases. Two ternary compounds were formed, one with stoichiometry varying from (Au 40.5Cu39)Sn20.5 to (Au20.2Cu 59.3)Sn20.5 (ternary "B"), the other with the composition Au34Cu33Sn33 (ternary "C"). The measured phase boundary compositions of the product phases are plotted on the available Au-Cu-Sn isotherm and the phase equilibria are discussed. The complexity and average thickness of the diffusion zone decreases with increasing Cu content except for the Au(40 at.%Cu) couple. © 2014 TMS.

Original languageEnglish
Pages (from-to)3357-3371
Number of pages15
JournalJournal of Electronic Materials
Volume43
Issue number9
DOIs
Publication statusPublished - 2014
MoE publication typeA1 Journal article-refereed

Keywords

  • Au(Cu)/Sn diffusion couple
  • phase equilibria
  • reactive diffusion

Fingerprint Dive into the research topics of 'Phase evolution in the AuCu/Sn system by solid-state reactive diffusion'. Together they form a unique fingerprint.

Cite this