Oxide thin films by ALD for advanced applications

Lauri Niinistö

Oxide thin films by ALD for advanced applications

Lauri Niinistö

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Original language	English
Title of host publication	AVS Topical Conference On Atomic Layer Deposition, Hanyang Institute of Technology, Hanyang University, Seoul, Korea, August 19-21, 2002
Publisher	American Vacuum Society
Pages	25
Publication status	Published - 2002
MoE publication type	A4 Conference publication

Keywords

ALD
oxides
thin films

Cite this

@inproceedings{ede8482f29a64ffeb871fc56350a6e72,

title = "Oxide thin films by ALD for advanced applications",

keywords = "ALD, oxides, thin films, ALD, oxides, thin films, ALD, oxides, thin films",

author = "Lauri Niinist{\"o}",

year = "2002",

language = "English",

pages = "25",

booktitle = "AVS Topical Conference On Atomic Layer Deposition, Hanyang Institute of Technology, Hanyang University, Seoul, Korea, August 19-21, 2002",

publisher = "American Vacuum Society",

address = "United States",

}

Oxide thin films by ALD for advanced applications. / Niinistö, Lauri.
AVS Topical Conference On Atomic Layer Deposition, Hanyang Institute of Technology, Hanyang University, Seoul, Korea, August 19-21, 2002. American Vacuum Society, 2002. p. 25.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Oxide thin films by ALD for advanced applications

AU - Niinistö, Lauri

PY - 2002

Y1 - 2002

KW - ALD

KW - oxides

KW - thin films

KW - ALD

KW - oxides

KW - thin films

KW - ALD

KW - oxides

KW - thin films

UR - http://www.avs.org

M3 - Conference article in proceedings

SP - 25

BT - AVS Topical Conference On Atomic Layer Deposition, Hanyang Institute of Technology, Hanyang University, Seoul, Korea, August 19-21, 2002

PB - American Vacuum Society

ER -

Oxide thin films by ALD for advanced applications

Keywords

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Cite this