@inproceedings{4156e740f4284e41920f8476be8ed257,
title = "On the role of electromigration in power cycling tests",
keywords = "cyclic electrical loading, cyclic power, drop testing, electrical current, electron flow, electron flux, failure mechanism, interfacial microstructure, intermetallic layer, mechanical integrity, mechanical loading, power cycling, solder interconnections, cyclic electrical loading, cyclic power, drop testing, electrical current, electron flow, electron flux, failure mechanism, interfacial microstructure, intermetallic layer, mechanical integrity, mechanical loading, power cycling, solder interconnections, cyclic electrical loading, cyclic power, drop testing, electrical current, electron flow, electron flux, failure mechanism, interfacial microstructure, intermetallic layer, mechanical integrity, mechanical loading, power cycling, solder interconnections",
author = "Vesa Vuorinen and Juha Karppinen and Tomi Laurila and Aloke Paul and Mervi Paulasto-Kr{\"o}ckel",
year = "2010",
language = "English",
isbn = "978-1-4244-8553-6",
pages = "1--7",
booktitle = "ESTC 3rd Electronic System-Integration Technology Conference, ESTC 2010; Berlin; 13-20 September 2010",
publisher = "IEEE",
address = "United States",
}