On the role of electromigration in power cycling tests

Vesa Vuorinen, Juha Karppinen, Tomi Laurila, Aloke Paul, Mervi Paulasto-Kröckel

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Original languageEnglish
Title of host publicationESTC 3rd Electronic System-Integration Technology Conference, ESTC 2010; Berlin; 13-20 September 2010
Place of PublicationBerliini
PublisherIEEE CPMT
Pages1-7
ISBN (Electronic)978-1-4244-8554-3
ISBN (Print)978-1-4244-8553-6
Publication statusPublished - 2010
MoE publication typeA4 Article in a conference publication

Keywords

  • cyclic electrical loading
  • cyclic power
  • drop testing
  • electrical current
  • electron flow
  • electron flux
  • failure mechanism
  • interfacial microstructure
  • intermetallic layer
  • mechanical integrity
  • mechanical loading
  • power cycling
  • solder interconnections

Cite this

Vuorinen, V., Karppinen, J., Laurila, T., Paul, A., & Paulasto-Kröckel, M. (2010). On the role of electromigration in power cycling tests. In ESTC 3rd Electronic System-Integration Technology Conference, ESTC 2010; Berlin; 13-20 September 2010 (pp. 1-7). IEEE CPMT.