On the role of electromigration in power cycling tests

Vesa Vuorinen, Juha Karppinen, Tomi Laurila, Aloke Paul, Mervi Paulasto-Kröckel

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Original languageEnglish
Title of host publicationESTC 3rd Electronic System-Integration Technology Conference, ESTC 2010; Berlin; 13-20 September 2010
Place of PublicationBerliini
PublisherIEEE CPMT
ISBN (Electronic)978-1-4244-8554-3
ISBN (Print)978-1-4244-8553-6
Publication statusPublished - 2010
MoE publication typeA4 Article in a conference publication


  • cyclic electrical loading
  • cyclic power
  • drop testing
  • electrical current
  • electron flow
  • electron flux
  • failure mechanism
  • interfacial microstructure
  • intermetallic layer
  • mechanical integrity
  • mechanical loading
  • power cycling
  • solder interconnections

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