Projects per year
Abstract
In-memory computing (IMC) accelerators have become a pivotal architecture for enhancing AI algorithm computations, particularly critical for embedding deep neural networks (DNNs) in edge devices. The efficiency of these systems is paramount, yet IMC cores are prone to fluctuations due to process, temperature, and voltage variations, which can detrimentally impact DNN accuracy. This research introduces an innovative Built-In Self-Calibration (BISC) methodology, specifically designed to compensate for temperature-induced variations in mixed-signal IMC cores. The methodology enables real-time, on-chip adjustment of DNN weights during computation within the IMC core without modifying the computation path. The proposed approach, implemented on a silicon prototype, not only maintained DNN computation accuracy under substantial temperature variations but also fully compensated for almost 90% of the offset caused by these variations, without introducing any non-idealities.
Original language | English |
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Title of host publication | Proceedings - 2024 29th IEEE European Test Symposium, ETS 2024 |
Publisher | IEEE |
Number of pages | 6 |
ISBN (Electronic) | 979-8-3503-4932-0 |
DOIs | |
Publication status | Published - 2024 |
MoE publication type | A4 Conference publication |
Event | IEEE European Test Symposium - The Hague, Netherlands Duration: 20 May 2024 → 24 May 2024 Conference number: 29 |
Publication series
Name | Proceedings of the European Test Workshop |
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ISSN (Print) | 1530-1877 |
ISSN (Electronic) | 1558-1780 |
Conference
Conference | IEEE European Test Symposium |
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Abbreviated title | ETS |
Country/Territory | Netherlands |
City | The Hague |
Period | 20/05/2024 → 24/05/2024 |
Keywords
- In-memory computing (IMC)
- multiply-and-accumulate (MAC)
- temperature sensor
- thermal compensation
Fingerprint
Dive into the research topics of 'On-chip Built-In Self-Calibration of Thermal Variations for Mixed-Signal In-Memory Computing'. Together they form a unique fingerprint.Projects
- 2 Finished
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WHISTLE: When integrated systems gain life experience: towards self-learning circuits with resource-efficient embedded artificial intelligence
Andraud, M. (Principal investigator), Adam, K. (Project Member), Yao, L. (Project Member), Periasamy, K. (Project Member), Leslin, J. (Project Member) & Bhowmick, S. (Project Member)
01/09/2020 → 31/08/2024
Project: Academy of Finland: Other research funding
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EHIR: Wireless impulse radio data link powered by energy harvesting
Halonen, K. (Principal investigator), Monga, D. (Project Member), Numan, O. (Project Member), Singh, G. (Project Member), Tanweer, M. (Project Member), Ylä-Oijala, P. (Project Member), Gallegos Rosas, K. (Project Member), Adam, K. (Project Member), Najmussadat, M. (Project Member) & Wang, Z. (Project Member)
01/09/2020 → 31/08/2023
Project: Academy of Finland: Other research funding
Equipment
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Aalto Electronics-ICT
Ryynänen, J. (Manager)
Department of Electronics and NanoengineeringFacility/equipment: Facility