Nucleation Kinetics and Solidification Temperature of SnAgCu Interconnections During Reflow

H. Yu, Jorma K. Kivilahti

    Research output: Contribution to journalArticleScientificpeer-review

    Original languageEnglish
    Pages (from-to)778-786
    JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
    Volume29
    Issue number4
    Publication statusPublished - 2006
    MoE publication typeA1 Journal article-refereed

    Cite this