Nucleation Kinetics and Solidification Temperature of SnAgCu Interconnections During Reflow

Hao Yu, Jorma K. Kivilahti

Research output: Contribution to journal › Article › Scientific › peer-review

Original language	English
Pages (from-to)	778-786
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	29
Issue number	4
Publication status	Published - 2006
MoE publication type	A1 Journal article-refereed

Cite this

@article{62173c6fd9354611bc8d433d7c89b934,

title = "Nucleation Kinetics and Solidification Temperature of SnAgCu Interconnections During Reflow",

author = "Hao Yu and Kivilahti, {Jorma K.}",

year = "2006",

language = "English",

volume = "29",

pages = "778--786",

journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",

issn = "2156-3950",

publisher = "IEEE",

number = "4",

}

TY - JOUR

T1 - Nucleation Kinetics and Solidification Temperature of SnAgCu Interconnections During Reflow

AU - Yu, Hao

AU - Kivilahti, Jorma K.

PY - 2006

Y1 - 2006

M3 - Article

SN - 2156-3950

VL - 29

SP - 778

EP - 786

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

IS - 4

ER -