Novel low-temperature interconnects for 2.5/3D MEMS integration: demonstration and reliability

Fahimeh Emadi, Vesa Vuorinen, Shenyi Liu, Mervi Paulasto-Krockel

Research output: Contribution to journal › Article › Scientific › peer-review

1 Citation (Scopus)
9 Downloads (Pure)

Fingerprint

Dive into the research topics of 'Novel low-temperature interconnects for 2.5/3D MEMS integration: demonstration and reliability'. Together they form a unique fingerprint.

Engineering

Material Science