@inproceedings{32ce5f5975d74b30a02d50ec6dc70f31,
title = "Novel IMB Technology for Integrating Active and Passive Components",
keywords = "active component integration, fully additive PWB technology, HDI substrates, IMB-technology, passive somponent integration, solderless, active component integration, fully additive PWB technology, HDI substrates, IMB-technology, passive somponent integration, solderless, active component integration, fully additive PWB technology, HDI substrates, IMB-technology, passive somponent integration, solderless",
author = "R. Tuominen and J. Kivilahti",
year = "2000",
language = "English",
pages = "269--273",
editor = "M. Hyyti{\"a}inen",
booktitle = "Adhesives in Electronics 2000, Helsinki, 18.-22.6.2000",
publisher = "Helsinki University of Technology",
address = "Finland",
}