Novel IMB Technology for Integrating Active and Passive Components

R. Tuominen, J. Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    25 Citations (Scopus)
    Original languageEnglish
    Title of host publicationAdhesives in Electronics 2000, Helsinki, 18.-22.6.2000
    EditorsM. Hyytiäinen
    Place of PublicationHelsinki
    PublisherHelsinki University of Technology, Electronics Production Technology, IEEE CPMT Finnish Chapter
    Pages269-273
    Publication statusPublished - 2000
    MoE publication typeA4 Article in a conference publication

    Keywords

    • active component integration
    • fully additive PWB technology
    • HDI substrates
    • IMB-technology
    • passive somponent integration
    • solderless

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