Multiscale simulation of recrystallization and grain growth of Sn in lead-free solder interconnections

Research output: Contribution to journalArticleScientificpeer-review

Researchers

  • Jue Li
  • Toni T. Mattila
  • Jorma Kivilahti

Research units

Details

Original languageEnglish
Pages (from-to)77-84
JournalJournal of Electronic Materials
Volume39
Issue number1
Publication statusPublished - 2010
MoE publication typeA1 Journal article-refereed

ID: 954610