Multiscale simulation of recrystallization and grain growth of Sn in lead-free solder interconnections

Jue Li, Toni T. Mattila, Jorma Kivilahti

    Research output: Contribution to journalArticleScientificpeer-review

    Original languageEnglish
    Pages (from-to)77-84
    JournalJournal of Electronic Materials
    Volume39
    Issue number1
    Publication statusPublished - 2010
    MoE publication typeA1 Journal article-refereed

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