Multiscale Simulation of Microstructural Changes in Solder Interconnections During Thermal Cycling

Research output: Contribution to journalArticleScientificpeer-review

Researchers

  • Jue Li
  • Toni Mattila
  • Jorma Kivilahti

Research units

Details

Original languageEnglish
Pages (from-to)77-84
JournalJournal of Electronic Materials
Volume39
Issue number1
Publication statusPublished - 2010
MoE publication typeA1 Journal article-refereed

    Research areas

  • finite element method, Monte Carlo method, recrustallization, reliability

ID: 938780