Mouldable all-carbon integrated circuits

D-M. Sun, M.Y. Timmermans, A. Kaskela, A.G. Nasibulin, Shigeru Kishimoto, Takashi Mizutani, E.I. Kauppinen, Y. Ohno

Research output: Contribution to journalArticleScientificpeer-review

119 Citations (Scopus)
149 Downloads (Pure)

Abstract

A variety of plastic products, ranging from those for daily necessities to electronics products and medical devices, are produced by moulding techniques. The incorporation of electronic circuits into various plastic products is limited by the brittle nature of silicon wafers. Here we report mouldable integrated circuits for the first time. The devices are composed entirely of carbon-based materials, that is, their active channels and passive elements are all fabricated from stretchable and thermostable assemblies of carbon nanotubes, with plastic polymer dielectric layers and substrates. The all-carbon thin-film transistors exhibit a mobility of 1,027 cm2 V−1 s−1 and an ON/OFF ratio of 105. The devices also exhibit extreme biaxial stretchability of up to 18% when subjected to thermopressure forming. We demonstrate functional integrated circuits that can be moulded into a three-dimensional dome. Such mouldable electronics open new possibilities by allowing for the addition of electronic/plastic-like functionalities to plastic/electronic products, improving their designability.
Original languageEnglish
Article number2302
Pages (from-to)1-8
JournalNature Communications
Volume4
DOIs
Publication statusPublished - 2013
MoE publication typeA1 Journal article-refereed

Keywords

  • carbon nanotubes
  • integrated circuits

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