Modeling the Attenuation of a Loosely-fit Insert Headphone for Augmented Reality Audio

Miikka Tikander

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

15 Citations (Scopus)
Original languageEnglish
Title of host publicationAES 30th International Conference on Intelligent Audio Environments, Saariselkä, Finland, March 15-17, 2007
Publication statusPublished - 2007
MoE publication typeA4 Article in a conference publication

Keywords

  • augmented reality
  • headphone
  • modeling

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