Modeling Stress in Ultra-Thin Flip Chip

P. Marjamäki, T. Reinikainen, J. Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    7 Citations (Scopus)
    Original languageEnglish
    Title of host publicationAdhesives in Electronics 2000, Helsinki, 18.-21.6.2000
    EditorsJ. Kivilahti, M. Hyytiäinen
    Place of PublicationHelsinki
    PublisherHelsinki University of Technology, Electronics Production Technology, IEEE CPMT Finnish Chapter
    Pages24-27
    Publication statusPublished - 2000
    MoE publication typeA4 Article in a conference publication

    Keywords

    • flip chip
    • reliability
    • thin chip

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