Modeling of Phase Evolution in Solder/Conductor Systems

K. Zeng, J. Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publicationSymposium on Packaging and Soldering Technologies for Electronic Interconnections,Nasville, USA, 11.-17.3.2000
    Place of PublicationNasville, USA
    PublisherTMS
    Pages43
    Publication statusPublished - 2000
    MoE publication typeA4 Article in a conference publication

    Keywords

    • interconnection
    • interfacial reaction
    • phase formation,
    • soldering
    • thermodynamics

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