@inproceedings{2ad8c659af234f869de28fb91b28395f,
title = "Modeling Capacitive Links for Broadband Inter-Chip Communication",
keywords = "3-D integration, capacitive interconnects, close-proximity communication, EM-modeling, 3-D integration, capacitive interconnects, close-proximity communication, EM-modeling, 3-D integration, capacitive interconnects, close-proximity communication, EM-modeling",
author = "Saska LIndfors and Olli Viitala and J. Flak",
year = "2007",
language = "English",
booktitle = "the 25th IEEE Norchip Conference , 19-20 November 2007, Aalborg, Denmark",
}