Microwave and millimeter-wave characterization of conductive ink film in rectangular waveguide

Xu Chen Wang, Ana Díaz-Rubio, Sergei Tretyakov

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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Abstract

An accurate approach to characterize the sheet impedance of thin conductive ink in rectangular waveguide is reported. This method allows retrieval of the sheet impedance without prior characterization of the supporting dielectric substrate. The ink sample is positioned between two waveguide flanges, introducing a discontinuous gap. The effect of the physical discontinuity can be removed by an additional measurement of the sample without ink layer. We have examined the extraction accuracy of the proposed method within the operating band of the waveguide, and also for various substrate thicknesses. Experimental results demonstrate the applicability of the proposed approach for sheet impedance measurements of ink films on both thin or thick (up to about quarter wavelength) substrates.

Original languageEnglish
Title of host publicationEuropean Microwave Week 2017
Subtitle of host publication"A Prime Year for a Prime Event", EuMW 2017 - Conference Proceedings; 47th European Microwave Conference, EuMC 2017
PublisherIEEE
Pages843-846
Number of pages4
Volume2017-January
ISBN (Electronic)9782874870477
DOIs
Publication statusPublished - 19 Dec 2017
MoE publication typeA4 Article in a conference publication
EventEuropean Microwave Conference - Nuremberg, Germany
Duration: 10 Oct 201712 Oct 2017
Conference number: 47

Conference

ConferenceEuropean Microwave Conference
Abbreviated titleEuMC
Country/TerritoryGermany
CityNuremberg
Period10/10/201712/10/2017

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