Abstract
This paper reports the progress of microsystem integration using hybrid microassembly, based on the recently finished EU FP7 project FAB2ASM. Hybrid microassembly is a technology that merges both highspeed coarse placement and high-accuracy self-alignment technologies. This paper addresses the basic concept of hybrid microassembly for microsystem integration and its process chain: component and interfaces, high speed and high accuracy assembly, and bonding and fixing. Issues regarding to the assembly site design for the self-alignment process will be discussed in details. Different variations of hybrid assembly processes will also be addressed. Finally, the paper discusses the applications of hybrid microassembly technology in: i) integration of microchips on lead-frames, ii) integration of surface emitting lasers, and iii) 3D integration of thin chips. The applicability of hybrid microassembly in other applications will also be discussed.
Original language | English |
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Title of host publication | Proceedings of the 5th Electronics System-Integration Technology Conference, ETC 2014 |
Publisher | IEEE |
Number of pages | 6 |
ISBN (Electronic) | 9781479940264 |
DOIs | |
Publication status | Published - 18 Nov 2014 |
MoE publication type | A4 Article in a conference publication |
Event | Electronics System-Integration Technology Conference - Helsinki, Finland Duration: 16 Sep 2014 → 18 Sep 2014 Conference number: 5 |
Conference
Conference | Electronics System-Integration Technology Conference |
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Abbreviated title | ESTC |
Country/Territory | Finland |
City | Helsinki |
Period | 16/09/2014 → 18/09/2014 |