Microsystem integration using hybrid microassembly

Quan Zhou; Ville Liimatainen; Iiris Routa

doi:10.1109/ESTC.2014.6962768

Microsystem integration using hybrid microassembly

Quan Zhou^*, Ville Liimatainen, Iiris Routa

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

2 Citations (Scopus)

Abstract

This paper reports the progress of microsystem integration using hybrid microassembly, based on the recently finished EU FP7 project FAB2ASM. Hybrid microassembly is a technology that merges both highspeed coarse placement and high-accuracy self-alignment technologies. This paper addresses the basic concept of hybrid microassembly for microsystem integration and its process chain: component and interfaces, high speed and high accuracy assembly, and bonding and fixing. Issues regarding to the assembly site design for the self-alignment process will be discussed in details. Different variations of hybrid assembly processes will also be addressed. Finally, the paper discusses the applications of hybrid microassembly technology in: i) integration of microchips on lead-frames, ii) integration of surface emitting lasers, and iii) 3D integration of thin chips. The applicability of hybrid microassembly in other applications will also be discussed.

Original language	English
Title of host publication	Proceedings of the 5th Electronics System-Integration Technology Conference, ETC 2014
Publisher	IEEE
Number of pages	6
ISBN (Electronic)	9781479940264
DOIs	https://doi.org/10.1109/ESTC.2014.6962768
Publication status	Published - 18 Nov 2014
MoE publication type	A4 Article in a conference publication
Event	Electronics System-Integration Technology Conference - Helsinki, Finland Duration: 16 Sep 2014 → 18 Sep 2014 Conference number: 5

Conference

Conference	Electronics System-Integration Technology Conference
Abbreviated title	ESTC
Country	Finland
City	Helsinki
Period	16/09/2014 → 18/09/2014

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10.1109/ESTC.2014.6962768

Cite this

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title = "Microsystem integration using hybrid microassembly",

abstract = "This paper reports the progress of microsystem integration using hybrid microassembly, based on the recently finished EU FP7 project FAB2ASM. Hybrid microassembly is a technology that merges both highspeed coarse placement and high-accuracy self-alignment technologies. This paper addresses the basic concept of hybrid microassembly for microsystem integration and its process chain: component and interfaces, high speed and high accuracy assembly, and bonding and fixing. Issues regarding to the assembly site design for the self-alignment process will be discussed in details. Different variations of hybrid assembly processes will also be addressed. Finally, the paper discusses the applications of hybrid microassembly technology in: i) integration of microchips on lead-frames, ii) integration of surface emitting lasers, and iii) 3D integration of thin chips. The applicability of hybrid microassembly in other applications will also be discussed.",

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language = "English",

booktitle = "Proceedings of the 5th Electronics System-Integration Technology Conference, ETC 2014",

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note = "Electronics System-Integration Technology Conference, ESTC ; Conference date: 16-09-2014 Through 18-09-2014",

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T1 - Microsystem integration using hybrid microassembly

AU - Zhou, Quan

AU - Liimatainen, Ville

AU - Routa, Iiris

N1 - Conference code: 5

PY - 2014/11/18

Y1 - 2014/11/18

N2 - This paper reports the progress of microsystem integration using hybrid microassembly, based on the recently finished EU FP7 project FAB2ASM. Hybrid microassembly is a technology that merges both highspeed coarse placement and high-accuracy self-alignment technologies. This paper addresses the basic concept of hybrid microassembly for microsystem integration and its process chain: component and interfaces, high speed and high accuracy assembly, and bonding and fixing. Issues regarding to the assembly site design for the self-alignment process will be discussed in details. Different variations of hybrid assembly processes will also be addressed. Finally, the paper discusses the applications of hybrid microassembly technology in: i) integration of microchips on lead-frames, ii) integration of surface emitting lasers, and iii) 3D integration of thin chips. The applicability of hybrid microassembly in other applications will also be discussed.

AB - This paper reports the progress of microsystem integration using hybrid microassembly, based on the recently finished EU FP7 project FAB2ASM. Hybrid microassembly is a technology that merges both highspeed coarse placement and high-accuracy self-alignment technologies. This paper addresses the basic concept of hybrid microassembly for microsystem integration and its process chain: component and interfaces, high speed and high accuracy assembly, and bonding and fixing. Issues regarding to the assembly site design for the self-alignment process will be discussed in details. Different variations of hybrid assembly processes will also be addressed. Finally, the paper discusses the applications of hybrid microassembly technology in: i) integration of microchips on lead-frames, ii) integration of surface emitting lasers, and iii) 3D integration of thin chips. The applicability of hybrid microassembly in other applications will also be discussed.

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M3 - Conference contribution

AN - SCOPUS:84918590413

BT - Proceedings of the 5th Electronics System-Integration Technology Conference, ETC 2014

PB - IEEE

T2 - Electronics System-Integration Technology Conference

Y2 - 16 September 2014 through 18 September 2014

ER -

Microsystem integration using hybrid microassembly

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