Microsystem integration using hybrid microassembly

Quan Zhou*, Ville Liimatainen, Iiris Routa

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

2 Citations (Scopus)

Abstract

This paper reports the progress of microsystem integration using hybrid microassembly, based on the recently finished EU FP7 project FAB2ASM. Hybrid microassembly is a technology that merges both highspeed coarse placement and high-accuracy self-alignment technologies. This paper addresses the basic concept of hybrid microassembly for microsystem integration and its process chain: component and interfaces, high speed and high accuracy assembly, and bonding and fixing. Issues regarding to the assembly site design for the self-alignment process will be discussed in details. Different variations of hybrid assembly processes will also be addressed. Finally, the paper discusses the applications of hybrid microassembly technology in: i) integration of microchips on lead-frames, ii) integration of surface emitting lasers, and iii) 3D integration of thin chips. The applicability of hybrid microassembly in other applications will also be discussed.

Original languageEnglish
Title of host publicationProceedings of the 5th Electronics System-Integration Technology Conference, ETC 2014
PublisherIEEE
Number of pages6
ISBN (Electronic)9781479940264
DOIs
Publication statusPublished - 18 Nov 2014
MoE publication typeA4 Article in a conference publication
EventElectronics System-Integration Technology Conference - Helsinki, Finland
Duration: 16 Sep 201418 Sep 2014
Conference number: 5

Conference

ConferenceElectronics System-Integration Technology Conference
Abbreviated titleESTC
CountryFinland
CityHelsinki
Period16/09/201418/09/2014

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