Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection

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@article{b1b640d4c7a44165961ebc8ed3e277f3,
title = "Microstructural evolution and mechanical properties of Au-20wt.{\%}Sn|Ni interconnection",
keywords = "Au-20wt{\%}Sn/Ni, interfacial reaction, thermodynamic, nanoindentation, hardness, indentation modulus",
author = "Hongqun Dong and Vesa Vuorinen and Xuwen Liu and Tomi Laurila and Jue Li and Mervi Paulasto-Kr{\"o}ckel",
year = "2016",
doi = "10.1007/s11664-015-4152-3",
language = "English",
volume = "45",
pages = "566--575",
journal = "Journal of Electronic Materials",
issn = "0361-5235",
number = "1",

}

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TY - JOUR

T1 - Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection

AU - Dong, Hongqun

AU - Vuorinen, Vesa

AU - Liu, Xuwen

AU - Laurila, Tomi

AU - Li, Jue

AU - Paulasto-Kröckel, Mervi

PY - 2016

Y1 - 2016

KW - Au-20wt%Sn/Ni

KW - interfacial reaction

KW - thermodynamic

KW - nanoindentation

KW - hardness

KW - indentation modulus

U2 - 10.1007/s11664-015-4152-3

DO - 10.1007/s11664-015-4152-3

M3 - Article

VL - 45

SP - 566

EP - 575

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 1

ER -

ID: 1484207