Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection

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Original languageEnglish
Pages (from-to)566-575
JournalJournal of Electronic Materials
Volume45
Issue number1
Publication statusPublished - 2016
MoE publication typeA1 Journal article-refereed

    Research areas

  • Au-20wt%Sn/Ni, interfacial reaction, thermodynamic, nanoindentation, hardness, indentation modulus

ID: 1484207