Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection

Hongqun Dong; Vesa Vuorinen; Xuwen Liu; Tomi Laurila; Jue Li; Mervi Paulasto-Kröckel

doi:10.1007/s11664-015-4152-3

Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection

Hongqun Dong, Vesa Vuorinen, Xuwen Liu, Tomi Laurila, Jue Li, Mervi Paulasto-Kröckel

Research output: Contribution to journal › Article › Scientific › peer-review

15 Citations (Scopus)

Original language	English
Pages (from-to)	566-575
Journal	Journal of Electronic Materials
Volume	45
Issue number	1
DOIs	https://doi.org/10.1007/s11664-015-4152-3
Publication status	Published - 2016
MoE publication type	A1 Journal article-refereed

Keywords

Au-20wt%Sn/Ni
interfacial reaction
thermodynamic
nanoindentation
hardness
indentation modulus

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10.1007/s11664-015-4152-3Licence: Unspecified

OtaNano
Rissanen, A. (Manager)
Aalto University
Facility/equipment: Facility
OtaNano - Nanofab
Repo, P. (Manager) & Rissanen, A. (Other)
OtaNano
Facility/equipment: Facility
Raw Materials Research Infrastructure
Karppinen, M. (Manager)
School of Chemical Engineering
Facility/equipment: Facility

Cite this

@article{b1b640d4c7a44165961ebc8ed3e277f3,

title = "Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection",

keywords = "Au-20wt%Sn/Ni, interfacial reaction, thermodynamic, nanoindentation, hardness, indentation modulus",

author = "Hongqun Dong and Vesa Vuorinen and Xuwen Liu and Tomi Laurila and Jue Li and Mervi Paulasto-Kr{\"o}ckel",

year = "2016",

doi = "10.1007/s11664-015-4152-3",

language = "English",

volume = "45",

pages = "566--575",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer",

number = "1",

}

TY - JOUR

T1 - Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection

AU - Dong, Hongqun

AU - Vuorinen, Vesa

AU - Liu, Xuwen

AU - Laurila, Tomi

AU - Li, Jue

AU - Paulasto-Kröckel, Mervi

PY - 2016

Y1 - 2016

KW - Au-20wt%Sn/Ni

KW - interfacial reaction

KW - thermodynamic

KW - nanoindentation

KW - hardness

KW - indentation modulus

U2 - 10.1007/s11664-015-4152-3

DO - 10.1007/s11664-015-4152-3

M3 - Article

SN - 0361-5235

VL - 45

SP - 566

EP - 575

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 1

ER -

Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection

Keywords

Access to Document

Equipment

OtaNano

OtaNano - Nanofab

Raw Materials Research Infrastructure

Cite this