Microstructural Characterization and Mechanical Performance of Wafer-Level SLID Bonded Au-Sn and Cu-Sn Seal Rings for MEMS Encapsulation

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Original languageEnglish
Pages (from-to)4533-4548
JournalJournal of Electronic Materials
Volume44
Issue number11
Publication statusPublished - 2015
MoE publication typeA1 Journal article-refereed

ID: 2024539