Microstructural Characterization and Mechanical Performance of Wafer-Level SLID Bonded Au-Sn and Cu-Sn Seal Rings for MEMS Encapsulation

Antti Rautiainen, Hongbo Xu, Elmeri Österlund, Jue Li, Vesa Vuorinen, Mervi Paulasto-Kröckel

Research output: Contribution to journal › Article › Scientific › peer-review

34 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Microstructural Characterization and Mechanical Performance of Wafer-Level SLID Bonded Au-Sn and Cu-Sn Seal Rings for MEMS Encapsulation'. Together they form a unique fingerprint.

Physics & Astronomy

Engineering & Materials Science

Chemical Compounds