Microstructural Characterization and Mechanical Performance of Wafer-Level SLID Bonded Au-Sn and Cu-Sn Seal Rings for MEMS Encapsulation

Antti Rautiainen, Hongbo Xu, Elmeri Österlund, Jue Li, Vesa Vuorinen, Mervi Paulasto-Kröckel

Research output: Contribution to journalArticleScientificpeer-review

34 Citations (Scopus)

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